The current delivery capability of this device is directly dependent on the thermal management implementation by the board
designer and the package selection.  Application notes are available on this subject and high power packages may have a
significant impact on the average unit price of this product.


Here is additional documentation and guidelines pertaining to package thermal considerations and
heat dissipation :
 

1.  (by Texas Instruments, pdf file) Digital Designer's Guide to Linear Voltage Regulators and Thermal Management

2.  AN1029 Fairchild, April, 1996
     Maximum Power Enhancement Techniques for SO-8 Power MOSFETs
     Alan Li, Brij Mohan, Steve Sapp,  Izak Bencuya, Linh Hong
  
3.  AN-569, Motorola, 1973
     Transient Thermal Resistance -- General Data and its Use
     Bill Roehr and Bryce Shiner